Renesas Electronics, a major power-semiconductor supplier, issued a price adjustment notice on September 10, announcing a new pricing structure that takes formal effect on January 1, 2027. This is the company's second price increase of the year — its previous notice was issued in March and became effective on July 1. In the notice, Renesas cited continuing structural cost increases across raw materials, energy, advanced packaging, manufacturing capacity and global logistics. With this move, the power-device price upcycle — driven jointly by rising input costs and demand spillover from AI compute — has now clearly extended into 2027.
The move is no isolated action. Overseas, Infineon's first adjustment this year covered power switches and related chips at 5%–15% effective April 1, followed by a second notice on May 26 effective July 1; Texas Instruments launched its fourth price round since 2025 on July 1. Domestically, after CR Micro and Silan Micro moved in the first quarter, both raised full-category prices by more than 15% from July 1; Yangjie Technology raised its full product range by 10%–15%, and StarPower raised IGBT and SiC MOSFET modules by more than 15%. Taiwan-based makers including Panjit and TSC are planning further spot-market increases of 10%–15% in October. Meanwhile, mainstream power-semiconductor lead times have stretched beyond 30 weeks. Surging demand for power chips in AI data-center power delivery and rack-level supply keeps absorbing mature-node capacity, with 8-inch fab utilization holding near 90%.
For the domestic components supply chain, an overseas IDM scheduling its next price round for early 2027 signals that the tight supply-demand balance in power devices will likely persist for the next three to four quarters. BofA and other institutions judge that the China power-semiconductor cycle is entering a more constructive phase: AI data centers and AI servers are improving the demand outlook, supply of low- and medium-voltage MOSFETs is tightening, and further price increases remain possible in the second half. For buyers, the window for negotiating annual contract prices and capacity quotas on MOSFETs, protection devices (TVS/ESD) and power-management ICs is moving earlier — and responsiveness in dynamic stocking, alternative sourcing and cross-brand comparison will become the decisive factor in fourth-quarter BOM management and cost control.