China Resources Microelectronics (CR Micro), a major domestic power-semiconductor IDM, recently held an earnings briefing and roadshow with more than 100 institutions in attendance. The company disclosed that, with order backlogs full and capacity tight, it implemented two rounds of product price increases in February and July; negotiations for the second round were largely concluded in July, at a notably larger magnitude and coverage than round one, with the full benefit expected to show in third-quarter financials. In H1, SiC revenue grew by more than 100% year on year, with automotive and energy-storage end markets together accounting for about 85% of the total. New capacity at its 12-inch fab line is slated for release in 2027.
Management framed the industry outlook as an "extended upcycle," citing three reinforcing drivers: AI is accelerating adoption across autonomous driving, embodied intelligence, smart terminals and compute infrastructure, lifting demand for power, analog and mixed-signal chips; industry capacity expansion remains orderly and slow to ramp, so the supply-demand gap is expected to keep widening; and customers now prioritize supply stability, delivery capability and reliability over price alone. On pricing, the company's BCD specialty process — spanning 1.8V to 1,200V — ran short of demand in H1 and has undergone multiple adjustments; with silicon-wafer and other raw-material costs rising, further pass-through is expected in the second half. CR Micro also positioned MEMS sensors and optical chips as its third growth curve.
For the domestic electronic components supply chain, this marks a shift into a phase where power devices are managed for stable pricing and lead-time certainty rather than spot bargains. For buyers of MOSFETs, IGBTs, third-generation power devices and modules, the window for fixed-price, fixed-capacity negotiations is narrowing, raising the value of dynamic inventory alerts and supply monitoring. A major IDM elevating MEMS sensors and optical chips to a third growth curve also points to faster qualification of domestic sensing and optocoupler devices in automotive and energy-storage programs. For complementary categories such as protection devices (TVS/ESD), power-management ICs, infrared/photoelectric sensors and optocouplers, the ability of downstream solution providers and distributors to deliver alternative sourcing, cross-brand comparison, quotes within 12 hours and coordinated inventory planning will become the decisive factor in second-half BOM management.