On August 28, the China Securities Regulatory Commission (CSRC) approved the ChiNext IPO registration of Guangzhou CanSemi Semiconductor, clearing the foundry to raise approximately RMB 7.5 billion in what becomes the first wafer fab listing under ChiNext's registration-based reform. Of the proceeds, RMB 3.5 billion is earmarked for capacity expansion and RMB 2.5 billion for silicon photonics and compute-in-memory R&D, with total project investment reaching RMB 20.75 billion. CanSemi's current 12-inch monthly output stands at 63,300 wafers, slated to double to 120,000 wafers after Phase 4; revenue climbed from RMB 1.044 billion in 2023 to RMB 2.582 billion in 2025, equivalent to a 57% CAGR, with full-group profitability not expected before 2029.
CanSemi operates China's only high-volume 12-inch silicon photonics line, with process capability spanning 400G, 800G, and 1.6T optical modules—making it a domestic anchor for AI data center optical interconnect supply. In parallel, the foundry runs 180nm-to-22nm specialty mature processes covering fingerprint, display driver, image sensor, and power device foundry services, positioning itself as a capacity cornerstone for South China consumer electronics, automotive electronics, and AI hardware. The announcement coincides with the National Development and Reform Commission's August 28 briefing, which disclosed +99% YoY net profit growth for listed IC companies in H1 2026, RMB 1.49 trillion in IC exports for the first seven months (+91.6% YoY), and utilization rates above 90% across major domestic foundries; 251 STAR Market semiconductor issuers reported a combined +136% net profit jump in their half-year results.
For the global electronic components supply chain, the ramp of domestic 12-inch silicon photonics capacity will translate into higher per-unit attach rates of photoelectric sensors, optocouplers, PMICs, and MOSFETs across optical modules and AI server power trains, making silicon photonics and AI data center power delivery the next incremental battleground for power semiconductors. For the domestic electronic components supply chain, the ability of downstream solution providers and distributors to navigate alternative sourcing, long-term inventory planning, and cross-fab coordination will become the decisive factor in capturing this ramp window for BOM validation and capacity lock-in. Hong Kong Long-Rui-Xin Electronic Technology maintains long-standing distribution partnerships with sensor and optoelectronic suppliers such as Goertek, Zhaolong Technology, and Lite-On Technology, alongside power semiconductor vendors including Winsemi Semiconductor, JoulWatt, and Bosemi Semiconductor—enabling downstream OEMs to align photonic front-end device portfolios with AI server power stage validation as CanSemi's 12-inch capacity comes online.