Reuters reported on September 18 that CXMT plans a NAND flash R&D line at its new Beijing fab, has set up a research institute covering NAND development, and has opened supply talks with AI and supercomputer storage customers. CXMT's Q2 DRAM revenue hit US$14.62 billion, up 99.3% QoQ, lifting its market share to 9.5%. With Samsung, SK Hynix and Micron prioritizing DRAM and HBM, TrendForce sees NAND tightness persisting into H2 2027 — buyers should lock volumes early.

Channel and market data confirmed on September 14 that TLVR coupled inductors for AI server power delivery are up 45%-70% this year, with scarce part numbers up 150% on spot. Murata is discontinuing consumer- and automotive-grade MLCC part numbers across nine series, shifting capacity to high-capacitance AI-server products with lead times now 20-26 weeks versus 8-10 weeks. Analysts expect the high-capacitance MLCC gap to persist into 2028 as passive-component pricing turns structural.

Renesas Electronics announced on September 10 a new pricing structure effective January 1, 2027 — its second hike this year, citing structural cost inflation in materials, energy, advanced packaging and capacity. With Infineon, Texas Instruments, CR Micro and Silan all raising prices multiple times, mainstream power-semiconductor lead times now exceed 30 weeks, and further increases are expected in H2 as procurement shifts to locking volume and delivery.

China Resources Microelectronics confirmed two rounds of product price hikes in February and July, and H1 SiC revenue more than doubled year on year, with automotive and energy-storage at about 85% of the total. The company expects the power-semiconductor supply-demand gap to widen into an extended upcycle, named MEMS sensors and optical chips its third growth curve, and plans 12-inch capacity release in 2027.

Huawei, Xiaomi and Honor raised prices on multiple in-market smartphones by RMB 200 to RMB 1,000 on September 1. TrendForce data shows memory prices have climbed 5–7x since early 2025, and a 12GB/256GB configuration reportedly jumped to about RMB 2,200. DRAM has overtaken the SoC in per-unit cost within a flagship phone, lifting memory's share of total BOM to 30%-40%. The squeeze is reshaping BOM budgets across consumer electronics and opening substitution windows for domestic component distribu

CanSemi Semiconductor's ChiNext IPO registration was cleared on August 28 by the CSRC, paving the way for approximately RMB 7.5 billion in fundraising and making the foundry the first wafer fab to list under ChiNext's registration-based reform. CanSemi earmarks RMB 3.5 billion for capacity expansion and RMB 2.5 billion for silicon photonics and compute-in-memory R\&D, lifting 12-inch monthly output from 63,300 wafers to 120,000 wafers. As China's only high-volume 12-inch silicon photonics line s

On August 21, Amazon raised prices across its hardware lineup, with the Echo Dot up 60%, Fire TV Stick 4K Max up 41.7%, and Kindle 16 GB up 36.4%, citing surging memory and storage component costs. TrendForce forecasts Q3 DRAM contract prices to rise 13%–18% and NAND Flash 10%–15%, confirming the AI-driven storage shortage has reached consumer shelf prices.

Taiwan power-semi makers plan a third 2026 price hike, raising non-contract spot prices 10%–15% from October, after 1H 2026 average prices already rose 15%–20% YoY and lead times on high-power MOSFETs and large-area TVS diodes stretched to 52 weeks. AI rack power is scaling from 120kW toward 1MW, making 800 VDC the definitive architecture for next-generation AI factories, and the AI data-center power-semi market is being revised from US 12𝐵𝑡𝑜𝑈𝑆 50B. Structural tightness opens a substitution

Samsung Electro-Mechanics raises all MLCC prices 30% from August 1, with Taiyo Yuden following on September 1. On the same day, Wcheon Electronics files ChiNext IPO to raise 1.675 billion yuan for high-end MLCC expansion. AI server MLCC demand reaches 10-15x traditional servers, with high-end shortage projected at 15-20% in H2 2026, accelerating the domestic substitution window.

Microsoft plans to unveil its in-house Maia 300 AI chip this fall, with negotiations underway to secure over 300,000 units from TSMC for 2027 delivery and a long-term target of one million. The move marks hyperscaler custom silicon transitioning from validation to volume substitution, driving sustained demand for high-voltage MOSFETs, PMICs, and MLCCs across AI server builds.